44) The Hybrid Champion

  
Large output thick film, IC “STK003” by Tokyo Sanyo Electric


It was IBM 's "SLT (Solid Logic Technology)" that was dominating in the hybrid IC market. Circuits were formed on multiple ceramic substrates by using thick film technology and chip parts, and the substrates were stacked three-dimensionally and connected with each other. They were used as the logic circuit elements in the company's third generation computer "360 series" and became big news.

In contrast, consumer electronics and automotive applications became mainstream in the Japanese domestic market. Among them, the large output thick film IC "STK 003" of Tokyo Sanyo Electric as shown in the picture was adopted in nearly 70% of stereo amplifiers of Japanese stereo audio products, and became an unexpected hit product. The story that Konosuke Matsushita visited the company factory upon catching word of this product is still often talked about to this day.

The secret weapon of this hit product was "IMST (insulated metal substrate technology)." The surface of the aluminum substrate was oxidized to form an anodized aluminum layer, and a copper foil coated with an adhesive for printed circuit board was adhered thereon to prevent the copper foil from bulging due to the generation of heat.

(Provided by Yoshio Miura)

End of Part-2

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